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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-110DBK/DUV-CT
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LG-110DBK/DUV-CT A 17 - Jul - 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Page 1/11
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with reflow solder process.
Descriptions:
1. The LG-110DBK/DUV SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use.
Device Selection Guide:
PART NO
MATERIAL InGaN/GaN InGaN/GaN
COLOR Emitted Blue Violet Water Clear Lens
LG-110DBK/DUV-CT
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Page 2/11
Package Dimensions
Cathode Mark
0.6 1.5 0.5 1 2 1.0
Resin
2
1 0.6
0.8
4 DIE2
3.2 DIE1 0.6 3 4 0.4 4 3
0.6
Soldering Terminal
0.4
PCB
1,2
DUV
4 3
DBK
Note : 1.All dimension are in millimeter tolerance is O 0.1mm unless otherwise noted. 2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
1.0 0.9 1,2
Cathode
1.5
5.0
4 1.0
3 1.0
1.5
Note : The tolerances unless mentioned is O 0.1mm,Angle O 0.5. Unit=mm.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Page 3/11
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Power Dissipation Peak Forward Current Duty 1/10@10KHz Forward Current Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature Symbol DBK PD IFP IF Ir ESD Topr Tstg Tsol 80 100 20 50 150 -40 ~ +85 -40 ~ +90 Max 260J for 5 sec Max DUV 80 100 20 50 150 mW mA mA UNIT
g A V J J
Typical Electrical & Optical Characteristics (Ta=25 J )
Items Luminous Intensity Symbol
DBK
Min. Typ. Max. UNIT 50 0.5 ------------------------------125 1.25 465 400 470 ---30 20 3.5 3.5 120 120 ------------------------4.0 4.0 ------V nm nm mcd
CONDITION IF=20mA IF=20mA
Iv
DUV DBK
Peak Wavelength
f P
DUV DBK
nm
Dominant Wavelength
fD
DUV DBK
IF=20mA
Spectral Line Half-Width
f
DUV DBK
IF=20mA
Forward Voltage
VF
DUV DBK
IF=20mA
Viewing Angle
2c 1/2
DUV
deg
IF=20mA
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Page 4/11
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100 10 1 01 1.0 2.0 3.0 4.0 5.0
Relative Intensity Normalize @20mA
2.5 2.0 1.5 1.0 0.5 0.0 1 10 100 1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25J
Relative Intensity@20mA Normalize @25J
-40 -20 0 20 40 60 80 100
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0 0.9 0.8
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity@20mA
1.0
0.5
0.0 400 450 500 550
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Page5/11
Typical Electro-Optical Characteristics Curve
DUV CHIP
Fig.1 Forward current vs. Forward Voltage
3.9 3.8 2.0 3.7
Fig.2 Relative Intensity vsForward Current
2.5
Forward Voltage(V)
3.6 3.5 3.4 3.3 3.2 3.1 20 30 40 50 60 70 80 90 100
Relative Intensity Normalize @20mA
1.5
1.0
0.5
0 20 30 40 50 60 70 80 90 100
Forward Current(mA)
Forward Current(mA)
Fig.3 Forward Current vs. Wavelength
Fig.4 Relative Intensity vs. Wavelength
1.0
420
410 400
Relative Intensity@20mA
20 40 60 80 100
Wavelength(nm)WLP
0.5
390 380
0.0 350
400
450
550
Forward Current(mA) Fig.5 Directive Radiation
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Page 6/11
Carrier Tape Dimensions
0.25 1.75 3.50.2 3.4 Polarity
4.00.2
2.0
1.5
8.00.3 5.3
1.25
4.00.2
1.87
Note : The tolerances unless mentioned is O 0.1mm,Angle O 0.5. Unit=mm.
E Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No. LG-110DBK/DUV-CT
Description 8.0mm tape,7"reel
Quantity/Reel 3000 devices
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Page 7/11
Label Explanation
uOqlu*~N/|-1/2
LIGITEK LED
LIGITEK ELECTRONICS CO., LTD.
Pb
BIN Q : Blue Chip Luminous Intensity BIN E : Violet Chip Luminous Intensity HUE 0B : Blue Chip Dominant Wavelength
PART NO. : LG-110DBK/DUV-CT LOT NO. : 92000363 Q'TY(PCS) : 3000 PCS BIN/HUE : Q/0B-E/400
VF:2.8 - 3.6 VF:2.8 - 3.6
HUE 400 : Violet Chip Dominant Wavelength 2.8 - 3.6 : Forward Voltage
Reel Dimensions
2.0O 0.5
0.8
0.6
0.4
0.2
178O 1.5
60O 1.0
0.4
r 13.5O 1.0
0.2
0.6
0.8
9.0O 1.0 12.0O 1.0
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Page 8/11
Box Explanation
1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H W
L
3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Recommended Soldering Conditions 1. Hand Solder
Basic spec is O 280J 3 sec one time only.
Page 9/11
2. Wave Solder
Soldering heat Max. 260 J 245O 5J within 5 sec Preheat
120 ~ 150J
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp. (J ) 240
Rising +5J /sec Cooling -5J /sec
150 120
Preheat
60 ~ 120 sec
5sec
Time
3-2 PB-Free Reflow Solder
1~5 C/sec 260C MaX. 10sec.Max
1~5C/sec
Preheat 180~200C
Above 220 C 60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Precautions For Use: Storage time:
1.The operation of Temperatures and RH are : 5 J ~35J ,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year at O 30J and O 90% relative humidity(RH) (from production date). 3.If opened more than one week in an atmosphere 5 J ~ 35J ,RH60%, they should be treated at 60 JO 5 J fo r 15hrs.
Page 10/11
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40 % of its desired value.
Circuit model A LED
Circuit model B LED
(A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110DBK/DUV-CT Reliability Test: Page 11/11
Classification
Test Item
Test Condition
1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Reference Standard
MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test Endurance Test Low Temperature Storage Test
1.Ta=105JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008 JIS C 7021: B-10
1.Ta=-40JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature High Humidity Storage Test
1.Ta=65JO 5J 2.RH=90%~95% 3.t=1000hrsO 2hrs
MIL-STD-202F:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105JO 5J &-40JO 5J (10min) (10min) 2.total 10 cycles
MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4
Solderability Test
1.T.Sol=235JO 5J 2.Immersion time 2O 0.5sec 3.Coverage U 95% of the dipped surface
Environmental Test
Temperature Cycling
1.105J ~ 25 J ~ - 55J ~ 25J 30mins 5mins 30mins 5mins 2.10 Cyeles
IR Reflow
1.T=260 C Max. 10sec.Max. 2. 6 Min
MIL-STD-750D:2031.2 J-STD-020

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